1. Design and simulation
Electrical simulation, thermal management and thermal mechanical reliability simulation, process simulation.
2. Advanced Packaging
a) SiP packaging, advanced sensor packaging, high-speed and high-density packaging, high-speed and high-frequency packaging,
CIS packaging, 3D packaging.
b) Substrates: high density substrates, coreless substrates, glass substrates.
c) Electrical test：signal integrity, power integrity, analog, digital, RF, EMI.
d) Reliability test and failure analysis：a variety of advanced reliability test and failure analysis equipment, such as DMA, TMA, TGA, X-ray.
e) Thermal test